Development of deburring technology for semiconductor microchips (Subsidy Project for Strengthening Semiconductor and Battery Industry Agglomeration in fiscal year 2024)
2023
Experimental demonstration of the usefulness of 3D data in the creation of pottery prototypes
2021
Mastering pottery manufacturing techniques
2020
Cooperation in the development of a new decarbonization product for the client Sapphire dicing test
2019
Monitor experiment of chuck table for dicing machine (Newly developed product by the dicing equipment manufacturer)
2018
Proposal of a new feature regarding the alignment recognition method of the dicing machine (Later standard implementation by the equipment manufacturer) Development of wastewater treatment method in dicing of Pb-containing materials (Joint development with pure water equipment manufacturer)
2017
Development of high-quality dicing blades for alumina (Joint development with blade manufacturer)
2016
Development of a new method device for local electrode printing of micro core products (joint development with a printing device manufacturer) Development of LED UV irradiator Acquisition of 3D CAD skills
2013
Development of mirror surface and polishing technology for single crystal (GaN) substrate (FY2013-2014 Yamaguchi Industrial Strategy Research and Development Subsidy Project, jointly developed with Yamaguchi University)
Development of dicing technology for special composite materials (successful development for materials that multiple other companies had given up processing)
2012
Development of high-precision dicing technology for soft ceramics Modification of scribe software(Elimination of defects, realization of 〇 shape processing)
2010
2008
Development and demonstration experiment of the principle of automatic detachment of blades (joint development with a dicing device manufacturer) Support for reverse engineering through our company's dicing for the development of a new product by a ceramics manufacturer
2006
Research and development of lead-free solder
2005
Development of automatic printing device (test machine) Development of dicing method
2004
Development of LED light inspection machine
Development of automatic printing inspection machine
2003
Development of electrode printing method Research on grinding and mirror finishing technology
2000
1999
Research and development of alternative freon cleaning
1998
Acquisition of surface mounting technology
1995
We will omit the research and development activities prior to 1995 due to the scarcity of information from that time.
Other development examples
Improvement of step retention by new design of printing jig
Discuss with jig processing manufacturers how to process the pocket and create
30％ increase in printing step retention
Productivity improvement by new design of transfer jig
Design of jig using 3DCAD in-house
400％ increase in productivity
Research on suction fixation of screen printing
Research on suction position, hole diameter, pocket shape, size, etc.
Enhancement of filling rate, step retention, and printing accuracy
Research on chip peeling methods
Research through demonstration tests with existing products and jigs designed in-house
Improvement in workability and step retention
Research on metal joining
Responded to customer requests for experiments with the equipment we own + gas procurement to make it possible
Research on UV irradiation
Research on the difference in transmittance and heat conductivity depending on the type of glass used in a UV irradiator and its effect on tape stripping property and residue
Improved workability, less residue
Monitoring of unpublished materials
Often, various manufacturers provide us with the latest products that have not been released yet, such as blades and tapes, and we carry out processing tests as monitors.
Improvement in productivity and quality, cost reduction
First Web-based Dicer Operator Training
In 2020, we wanted to take the operator training curriculum sponsored by the dicing machine manufacturer, but it was impossible to hold it on-site due to the Corona pandemic. Therefore, we asked for the first remote event at the manufacturer and had it carried out for our company.
Pyramid construction with ultra-fine machining
We tried to create a pyramid using dicing. The Z direction (processing depth) changes each time one blade is diced due to wear, but by controlling it with high precision, we were able to succeed in creating it.
Ultra-fine machining x skilled technique project for Katsushika Hokusai is underway.
