Materials

Processing Experience Available

Extensive Experience

・AlN (Aluminum Nitride) Skilled
・Al2O3 (Alumina) Skilled
・ZrO2 (Zirconia)
・Si (Silicon)
・Glass Materials
・Other Composite Materials

※Experiences with multi-type materials such as Al2O3+W,
　Cu+C, AlN+Cu, etc.

Processing Experience Available

Test Level

・Al2O3 (Sapphire)
・Y3Al5O12(YAG)
・Plastic Materials
・SiC (Silicon Carbide)

・Pb(Zr,Ti)O3　 (PZT, Lead Zirconate Titanate)※

※For mass production, a waste treatment system is necessary.
　No Experience

No Experience

Would Like to Attempt

・Si3N4 (Silicon Nitride)
・GaN (Gallium Nitride)
　etc.

Front and Back Film Material of the Material

　Ti, Ni, Pd, Ag, Sn, Pt, Au, Pb, Glaze, etc.

　※The adhesion compatibility between the material and the tape, as well as the　　　　　　　
　　thickness and material of the film, may cause burrs or chipping.

　　We at LEAD Co., Ltd. will verify the optimal processing conditions and program.

Original Size of the Material　

　・For round shapes, up to Φ8 inches (Φ200mm)

　・For square shapes, up to □141x141mm

　・Thickness: It depends on the hardness of the material, but approximately 0.1 to 5mm

Chip Size After Dicing

　・Chip Size: From □0.3mm upwards

　・Accuracy: Depends on the difficulty of processing the material.
      We have a track record of ±10μm, etc.

Supply Form of Material

• As Is Material
• State of Being Taped
• State of Being Affixed to Glass　etc.

Shipping Form

• State of Being Attached to Dicing Tape
• State of Being Replaced with Picking Tape
• Detached from Tape and Stored in Shipping Tray　etc.

Other Supply Examples

• Blade
• Tape
• Shipping Tray　etc.　
• There are cases where you can provide various supplies or we might procure them at LEAD Co., Ltd. We will respond to your needs accordingly.